Metalization of Polymers: Copper on Cyclotene
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Abstract
An analysis of the demands of ULSI and GSI technologies shows the necessity of multi-layer devices to reduction of signal transmission delay time. This reduction is realized by using a better conductor metal, such as Cu and a surrounding insulator with low capacity than actually used, such as Dow Cyclotene 3022. In this paper, the results of evaporated and sputtered Cu to Dow Cyclotene 3022 were studied. After presentation of interfacial reaction that causes adherence, the methods of enhanced adherence as surface modification of polymer by nitrogen plasma have been investigated.
Keywords: Metalization, Cyclotene, Adherence, Plasma, Multi-layer
Keywords: Metalization, Cyclotene, Adherence, Plasma, Multi-layer
Keywords
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